Carnegie Mellon University
Steinbrenner Institute for Environmental Education and Research  ›  People  ›  Faculty Affiliates  ›  Sheng Shen

Sheng Shen

Sheng Shen

Professor, Mechanical Engineering
Courtesy Appointment, Electrical and Computer Engineering, Materials Science and Engineering

Address
5000 Forbes Avenue
Pittsburgh, PA 15213

Bio

Sheng Shen is a professor in the Mechanical Engineering Department of Carnegie Mellon University (CMU). He also holds courtesy appointments in both the Electrical and Computer Engineering and the Materials Science and Engineering Departments at CMU. He received his Ph.D. degree from the Mechanical Engineering Department at MIT, and BS and MS degrees from Huazhong University of Science and Technology in China. Prior to joining CMU in 2011, he conducted his postdoctoral research at UC-Berkeley. His research focuses on nanophotonics, nanoscale energy transport and conversion, nanofabrication and advanced manufacturing, and their applications in thermal management, light sources and devices, thermal emission control, solar or thermal energy conversion, infrared sensing and detection, multifunctional materials, and others.

Shen is a recipient of NSF CAREER Award, DARPA Director’s Fellowship, DARPA Young Faculty Award, and Elsevier/JQSRT Raymond Viskanta Award for Spectroscopy and Radiative Transfer. He also received the CMU Dean’s Early Career Fellowship, the Philomathia Foundation Research Fellowship in Alternative Energy Research from UC-Berkeley, a Hewlett-Packard Best Paper Award from ASME Heat Transfer Division, and a Best Paper Award in Julius Springer Forum on Applied Physics.

Education

  • Postdoc., Mechanical Engineering, University of California, Berkeley, 2011
  • Ph.D., Mechanical Engineering, Minor in Electrical Engineering, Massachusetts Institute of Technology, 2010
  • MS, Engineering Thermophysics, Huazhong University of Science and Technology, 2003
  • BS, Power Engineering, Huazhong University of Science and Technology, 2000

Shen describes his work developing low-density, multi-functional materials that have a broad range of applications in aerospace, automotive, and biomedical technologies.

Shen describes two examples of his research: thermal interface materials for advanced thermal management of microelectronics and control of thermal emission for energy applications.